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In this paper, evaluation of underfill materials for 3D SiP packages where micro bump interconnections and solder bumps has been presented. Characterization of underfill materials was carried out in terms of adhesion testing on various chip passivation surfaces and process optimization for void free filling. Capillary underfill materials have been evaluated for micro bump interconnections for 3D stacked...
The requirements for high density packaging such as smaller form factor, high performance and multi functionality electronics products have resulted in electronics industry moving towards 3D System in package technology (3D SIP). Some of the main advantages of 3D SIP packaging are high volume applications, smaller form factor, better connectivity between components in a 3D package, lower noise, lower...
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