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This paper presents, the development of large multi-chip fan-out wafer level package (FOWLP) based Package-on-Package (PoP) using mold-First FOLWP integration flow for mobile applications. As part of this development, conventional mold-First FOWLP wafer reconstruction process has been optimized and selected key materials to overcome the challenges such as die shift, die protrusion, warpage. Fine pitch...
Recently, Fan-out Wafer Level Packaging (FOWLP) has been emerged as a promising technology to meet the ever increasing demands of the consumer electronic products. However, conventional FOWLP technology is limited to small size packages with single chip and Low to Mid-range Input/ Output (I/O) count due to die shift, warpage and RDL scaling issues. In this paper, we are presenting new RDL-First FOWLP...
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