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Along with high performance and miniaturization of electronic components, there is a tremendous demand for package substrate with thinner and higher density Coreless substrate could meet the requirement, which eliminates the core part in the substrate and utilizes only its build up materials to interconnect between the chip and PCB board. The major challenge for coreless substrate manufacturing and...
Coreless substrate is a promising next generation substrate. Coreless substrate has very low z-height, which means such substrate will be lighter, smaller and it will have very short interconnection, fine linewidth, and good power integrity. But the major challenge for coreless substrate manufacturing and assembly processing is reducing warpage. In this paper, we introduced a novel coreless substrate...
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