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We experimentally realize a patterned hyperbolic metafilm with engineered and freely tunable absorption band from near-IR to mid-IR spectral regions based on multilayered metal/dielectric hyperbolic metamaterial waveguide taper.
In this paper, power-plane and ground-plane characterization on laminate packages and on wafer-level packages are carried out, and the electrical performance, in terms of loop-inductance, power-net isolation, signal-net cross-talk, from the two packaging technologies are compared. Measurement data on test structures is used to correlate the simulation approaches for signal traces with holes in their...
We computationally and experimentally demonstrate super absorption, in a flat ultra-thin organic photovoltaic layer on metal substrates, based on interference effects of strongly absorptive ultra-thin films.
We have investigated the impact of die thickness on integrated passive device (IPD) performance both in simulation and from measurement for RF stack-die applications. Our simulation approach accurately predicts the behavior of the IPD in such stack-die configuration. This should help us to generate guidelines for RF integrated passive devices to be used in 3D stack-die packages.
GaAs based hetero-junction bipolar transistors (HBTs) offer high speed and good device matching characteristics that are attractive for many high-speed circuits. However, thermal behaviors with multi-fingers can significantly affect HBTs performance. In this paper, three dimensional (3-D) finite-element modeling (FEM) approaches are built up to analyze the maximum temperature region and temperature...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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