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Comprehensive finite element analysis (FEA) modeling is carried out to improve the performance of critical designs of wafer level chip scale package (WLCSP). First, a design with one layer redistribution layout (RDL) copper with etched pocket in the non-covered UBM area and one layer polyimide structure (1Cu1Pi design) is investigated. Different polyimide layouts, copper thicknesses, pocket parameters...
Intensive FEA modeling was applied to the investigation of early solder joint failures of WLCSP mounted on test PCBs. In particular, stress in assembly reflow process was studied with 25 balls; 0.4 mm pitch WLCSP and PCBs with specially placed plated though vias. The 25 ball WLCSP in the study has 5×5 ball array, which corresponds to 16 outmost solder joints and nine inner solder joints, all soldered...
In this paper, a comprehensive modeling is carried out to investigate the dynamic behaviors of WL-CSP subjected to both flat and vertical drop impacts. The non-linear dynamic properties include solder, Cu pad and the metal stacking under the UBM. Both of the JEDEC standard flat drop test and the vertical drop test modeling for different solder bump height are studied. The results showed that, in the...
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