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Three-dimensional integrated circuits are a natural platform for IoT devices. IoT devices exhibit a small footprint, integrate disparate technologies, and require long term sustainability (extremely low power or self powered). A hybrid energy harvesting system within a three-dimensional integrated circuit is proposed in this paper. The harvesting system exploits different types of energy available...
Through-substrate vias (TSVs) are key for enabling 3-D integrated circuits (ICs). A hexagonal topology for TSV bundles in 3-D ICs is introduced in this brief. The topology exhibits superior symmetry as compared to the standard mesh topology. A comparison between the hexagonal and mesh topologies in terms of area per TSV, capacitive coupling, effective inductance, and shielding characteristics is offered...
A layer ordering algorithm to minimize the total number of TSVs within heterogeneous 3-D integrated circuits is described in this paper. Different constraints may complicate the process of ordering the layers within a 3-D system. These constraints are (1) any two layers must be adjacent, (2) a layer must be placed at a specific location, and (3) a layer must be separated from another layer(s). The...
The effects of inductive coupling among TSVs within large TSV arrays are investigated in this paper. A comparison of the equivalent inductance of a paired TSV model and arrayed TSV macromodel is presented for three TSV distribution topologies, grouped, lined, and uniform, within the power network. Modified closed-form expressions are proposed to determine the equivalent inductance of a TSV in these...
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