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Three-dimensional integrated circuits are a natural platform for IoT devices. IoT devices exhibit a small footprint, integrate disparate technologies, and require long term sustainability (extremely low power or self powered). A hybrid energy harvesting system within a three-dimensional integrated circuit is proposed in this paper. The harvesting system exploits different types of energy available...
Models of coupling noise from an aggressor module to a victim module by way of through silicon vias (TSVs) within heterogeneous 3-D integrated circuits (ICs) are presented in this paper. Existing TSV models are enhanced for different substrate materials within heterogeneous 3-D ICs. Each model is adapted to each substrate material according to the local noise coupling characteristics. The 3-D noise...
A layer ordering algorithm to minimize the total number of TSVs within heterogeneous 3-D integrated circuits is described in this paper. Different constraints may complicate the process of ordering the layers within a 3-D system. These constraints are (1) any two layers must be adjacent, (2) a layer must be placed at a specific location, and (3) a layer must be separated from another layer(s). The...
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