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The lead-free Sn–Ag–Cu (SAC 305/405) solder that replaced the tin–lead eutectic solder tends to be more brittle in nature due to high stiffness and excessive solder interfacial reactions. This leads to higher occurrences of solder joints failure during surface mount assembly and handling operations as a result of PCB bending, shock impact and drop. In this work, mechanical tests simulating the shock...
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