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This paper reports the first direct experimental measurement of electromigration-induced stress in aluminum interconnects, using a series of microrotating stress sensors. The build-up of stress gradients in interconnect metallization, which is concomitant with backstress, has been previously investigated theoretically, but experimental verification using optical or X-ray techniques has proven more...
This paper reports the first direct experimental measurement of electromigration-induced stress in aluminum interconnects using a series of micro-rotating stress sensors. The build up of stress gradients in interconnect metallization concomitant with back stress have been previously investigated theoretically, but experimental verification using optical or X-ray techniques has proven more difficult...
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