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The “black pad” phenomenon of Ni-P electroless plating has been one of the serious electronics failures in the market although this plating is known to be a useful barrier coating against oxidation. To understand the mechanism of this phenomenon, the weak interfaces of Ni-P plating soldered with leaded and lead-free solders have been analyzed with the aid of transmission-electron microscopy. Two causes...
The formation of solidification defects in lead-free soldering is greatly influenced by material factors as well as the design of circuit assemblies. To establish ideal processing conditions and design concepts for sound soldering structures, defect formation in Sn-Ag-Cu for various types of circuit assemblies must be understood. In this study, the solidification process of Sn-3Ag-0.5Cu solder balls...
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