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We demonstrate for the first time the fabrication and electrical characterization of planar SOI Tunnel FETs (TFETs) with low temperature (LT) processes devoted to 3D sequential integration. The electrical behavior of these TFETs, with junctions obtained by Solid Phase Epitaxy Regrowth (SPER), is analyzed and compared to reference samples (regular process at high temperature, HT). The threshold voltage...
In this paper, the recent advances in low temperature process in view of 3D VLSI integration are reviewed. Thanks to the optimization of each low temperature process modules (dopant activation, gate stack, epitaxy, spacer deposition) and silicide stability improvement, the top layer thermal budget fabrication has been decreased in order to satisfy the requirements for 3D VLSI integration.
In this paper, the energy process window of nanosecond (ns) laser annealing for junctions activation has been determined for several dopants (As, P, BF2). The different recrystallization states observed when tuning laser energy density are explained by numerical simulations. Within these conditions, the laser impact on the thermal stability of ULK/copper inter-tiers interconnections has been evaluated...
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