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Silver (Ag) film has wide applications in micro-electromechanical system such as reference electrode, interconnect and inductance. The majority of Ag metallisation patterning is realised by dry technology, which is inefficient and high cost. Electroplating process using negative photoresist SU-8 as the electroplating mould has been reported for Ag film patterning. However, the UV solidified SU-8 is...
In this paper, a new electroplating mask regarding deep etching on glass was revealed. It consisted of sputtered Chromium and Copper layer with electroplated Chromium and Gold layer, in combination with hard baked thick photoresist AZ4620 mask layer. After more than 3 hours' immerging in the HF etching solution, the etching depth attained more than 500μm. By using hard baking photoresist, the smoother...
Through-mask electroplating has been widely used in the fabrication of chips, BGA substrates and PCBs etc. The uniformity of plating thin-film is the major factor contributed to the reliability of the products. Currently, it is usually by setting optimum plating parameters and adopting electrochemical method to achieve the uniformity of plating. However, the problem of non-uniform distribution of...
An out-of-plane micro thermal polymer actuator, which is designed with the bimorph effect, is presented. This actuator has a bi-layer structure, which consists of SU-8 photoresist encapsulating meandering nickel heater and passive Ni top layer. The actuator has a symmetric configuration. This paper demonstrates its design, simulation, fabrication and device tests. This actuator bends vertically when...
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