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As one of the important factors affecting the quality of soldering joints, the intermetallic compound (IMC) formed at the solder and substrate interface becomes more and more concerned by researchers. However, it's difficult to study the effect of cooling process on the growth of IMC for the continuity and high temperature of the soldering process. This paper making use of high-pressure air to remove...
By virtue of the synchrotron radiation imaging combing the analysis of the actual soldering morphology data in lab, we have a more specific understanding of the characteristic of nucleation and growth of Ag3Sn. In furnace cooling conditions, inside the pure Sn3.0Ag solder, there is no sheet Ag3Sn formed. The IMC at the soldering interface is a priority site for the nucleation of the Ag3Sn in the soldering...
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