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With the continuing increase in power dissipation requirements of electronic devices, there is a need to develop new thermal interface materials (TIM) with much higher thermal conductivity (K) than that available from conventional TIMs. Recently, liquid phase sintering (LPS) has been proposed as a new paradigm for designing next generation composite-solder TIMs with a radically different microstructure...
The heat dissipation time in an InP-based photonic crystal nano-cavity was measured. Our method is based on time-resolved reflectivity of a cw beam coupled through a tapered fiber. Dissipation times around 2 mus were obtained.
Because of their very high thermal conductivity, low melting point, and high shear compliance, indium-based materials are excellent candidates for thermal interface material (TIM) applications for packaging thermally sensitive next-generation devices. However, currently used indium-based solders suffer from 2 serious shortcomings: (i) high cost due to high indium content, and (ii) very low compressive...
At present, there is significant interest in low-temperature, indium-based materials for both thermal interface material (TIM) applications as well as interconnect applications for packaging thermally sensitive next-generation devices. The attractive properties of these solders include: (i) high shear compliance under low strain rate conditions, and (ii) high electrical/thermal conductivity, both...
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