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Silicon-glass devices are widely used in IC industry, MEMS and solar energy system because of their reliability and simplicity of the manufacturing process. With the trend toward the wafer level chip scale package (WLCSP) technology, the suitable dicing method of silicon-glass bonded structure wafer has become necessary. In this paper, a combined experimental and computational approach is undertaken...
A diode-end-pumped quasi-three-level orthogonally polarized continuous-wave (cw) dual-wavelength Nd:LiYF4 (Nd:YLF) laser that generates simultaneous laser at the wavelengths 903nm and 908nm was demonstrated. Two types of cavity configurations were studied to support the stable dual-wavelength operation of the laser. A polarization beam splitter (PBS) was placed in the first type of cavity to split...
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