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This paper reports the findings supporting that solder joint grain structure within an assembly is not fixed but varies with the joint location and cooling rate. Also reported is the fact that such change in grain structure can make the joint fatigue resistance to be increased. These conclusions are made by comparing the grain structure and fatigue kinetics of the joints in BGA assembly with variation...
This paper presents the results of isothermal shear fatigue tests conducted on Sn-Ag-Cu lead-free and Pb-Sn solder alloys in fully assembled PBGA configurations. Our study, aimed to better understand the fatigue behaviors of solder alloys in the package assembly, reveals that the shear fatigue test is indeed capable of measuring the fatigue properties of the solder itself and may lead to material...
This study concerns the failure mechanism of a lead-free SAC305 solder joint under the isothermal bending fatigue condition. For this, series of bending fatigue tests are carried out with the variations of bending displacement and frequency, and FEM analysis is conducted to examine the relationship between mechanical behavior of a solder joint and fatigue life cycle. The results of this investigation...
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