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A novel all-Parylene based multilayer organic interposer for high-density 3D packaging is presented. The multilayer interposer consists of both a thick 50µm Parylene substrate layer as well as thin layers, down to ∼50 nm, which are formed by successive conformal thin-film deposition. The processing of the layers utilizes standard thin film techniques such as photolithography, dielectric/metal deposition,...
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