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An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should be available,...
In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme. In addition, two low filled packaging polymers are included for comparison. The characterization scheme consists of the steps sample preparation, measurement of the material data, and modeling the material behavior. The dasiasample preparationpsila step included a DSC analysis to understand...
During the packaging of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die. For a reliable simulation of the stresses generated in a package during cure and subsequent cooling it is essential to have accurate data for the thermal and mechanical properties of the molding compound, die, solder and substrate materials...
In the electronic industry thermoset polymers are used as moulding compounds, underfill materials coatings and adhesives. A good knowledge of the cure shrinkage and material properties is needed to do reliable predictions of the stresses induced during packaging. In this paper, a novel technique using a new PVT (pressure-volume-temperature) apparatus is applied for measuring these quantities. The...
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