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In this paper we demonstrate the methodology for designing and optimizing the LEON3 multi-core microprocessor in 3D stacked ICs. Based on GDSII-level details, we compare the 3D IC implementations as well as the traditional 2D IC implementation. For 3D IC implementation, we compare three partitioning styles: core-level, block-level, and gate-level. These partitioning styles represent three most relevant...
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