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Three-dimensional integration (3D IC) technology has been gaining significant interest from the VLSI community for several years. However, layout-level explorations of the impact of 3D technology have only recently been introduced. This work examines both static and dynamic power-supply noise in a layout-level 3D design prototype, and the impact of possible 3D-specific changes to the power-supply...
3D integration has the potential to increase performance and decrease energy consumption. However, there are many unsolved issues in the design of these systems. In this work we study the design of many-tier (more than 4 tiers stacked) 3D power-supply networks and demonstrate a technique specific to 3D systems that improves IR-drop over a straightforward extension of traditional design techniques...
Many-tier systems are the future of 3D integration. In this work we explore power delivery system design for these large scale devices. We have developed a scalable many-tier design that contains one tier of processors and eight tiers of DRAM. These nine tiers comprise a 'set' that can be stacked any number of times. Previously, we have examined the dynamic and static power noise scaling behavior...
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