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With the rapid advance of enabling technologies, the era of 3D ICs is near. Yet, there are several practical problems to be solved for 3D ICs. Especially, heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. Recently, liquid cooling based on micro-fluidic channels is proposed as a viable solution to dramatically reduce the temperature of 3D ICs. In...
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-vias (T-TSVs) and micro-fluidic channel (MFC) based liquid cooling. In case of power delivery, a highly complex power distribution network is required to deliver currents reliably to all parts of the 3D stacked IC while suppressing...
Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solution to dramatically reduce the operating temperature of 3D ICs. In addition, designers use a highly complex hierarchical power distribution network in conjunction with decoupling capacitors to deliver currents to all parts of...
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