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Conventional bonding techniques like fusion, glass frit, soldering, eutectic, and anodic bonding, have been used in packaging for micro-electro-mechanical systems (MEMS). These bonding techniques require high temperature which results in bending/buckling of MEMS devices especially in case of hanging structures. In this work, low temperature and low cost bonding techniques with commercially available...
We present novel “interaction-free” realizations of quantum optical Fredkin gates that do not rely on direct physical coupling between the target light (signal) and the control light (pump). The interaction-free feature of such gates allow to overcome the fundamental limits of photon loss and quantum-state decoherence imposed by the signal–pump coupling. This advantage, together with the low inherent...
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