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The underlying variability in the ReRAM device operation, while undesired in many applications, can be advantageous for hardware security primitives. ReRAM devices also come with the advantage of having non-linear multi-state operation. By comparison with previous reported ReRAM PUFs, which utilized spatial variations in the devices' binary ON/OFF states, we proposed to use sneak path currents and...
One key to enable the successful implementation of 3-D interconnects using Through-Silicon Via (TSV) is the control of the mechanical stresses. The synchrotron-sourced X-ray microdiffraction technique has been recognized to allow some important advantages compared to other techniques. Using this approach, we have studied Cu TSV samples from Hynix, Inc. as well as from SEMATECH and found interesting...
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