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The effect of copper stress on the fermentation performance of Saccharomyces cerevisiae and its copper adsorption pathway during alcoholic fermentation were investigated in this study. At the limits imposed by the regulations of the European Union and South African (⩽20mg/l), copper had no effect on the cell growth of S. cerevisiae, but its fermentation performance was inhibited to a certain extent...
A new anthracenyl-appended ferrocene bearing the aniline N and the thiourea S donors (1) for multiple signaling sensing of metal ions, has been synthesized and characterized. Upon addition of various metal ions in CH3CN solution, 1 shows a distinctive response to Cu2+ and Hg2+ over other metal ions, with a large enhancement of the emission of 1, and an anodic shift of electrochemical potential. In...
Whiskers are pure tin mono-crystal. Electro-deposited tin layer as lead free finish in electrical devices tend to form whiskers. It can be formed soon after plating, several years after plating or even seldom happen. It is one potential danger for device reliability in industry usage. In this paper, whiskers growth on copper and Fe-Ni Alloy42 materials are individually inspected. For Fe-Ni Alloy42...
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