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This paper addresses both, the thermal and the thermo-mechanical performance of percolating thermal underfill applied flip-chip packages. We present a thermal test platform in flip-chip package design allowing the thermal conductivity of any underfill to be measured at package scale. We give details about design technology and current fabrication status. We benchmarked the thermal performance of the...
A high thermally conductive underfill material is key for the efficient removal of heat generated by a 3-dimensional chip stack. Improved thermal properties are achieved by creating a percolating microparticle network within the composite underfill material. In this work, the directed assembly of nanoparticle necks formed by capillary bridging is investigated in order to improve the thermal transport...
We present a methodology for the formulation of percolating thermal underfills (PTUFs) with enhanced thermal conductivity for efficient heat dissipation between dies in 3D chip stacks. The methodology is based on the centrifugal filling of micron-sized powders in a confined space (defined by a solder ball array) to form a percolating particle bed, and on the formation of enhanced thermal contacts...
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