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We present the design of a wafer-level vacuum-encapsulated silicon tuning fork resonator operating at 32 kHz, along with a low power Complementary Metal-Oxide Semiconductor (CMOS) sustaining amplifier towards an oscillator. The resonator is designed using MEMS Integrated Design for Inertial Sensors (MIDIS) process developed by Teledyne DALSA Semiconductor Inc. (TDSI). The MicroElectroMechanical Systems...
We present a wafer-level vacuum-encapsulated silicon resonator fabricated in MEMS Integrated Design for Inertial Sensors, a commercial pure-play MEMS process, recently introduced by Teledyne DALSA Semiconductor Inc. Our prototype Lamé mode encapsulated in an ultra-clean 10-mtorr vacuum cavity, achieved a quality factor of 3.24 million at a resonance frequency of 6.89 MHz, resulting in the highest...
We describe the design and fabrication of a resonant absolute MEMS pressure sensor using a semi-custom fabrication process. We selected a double anchored Double-Ended Tuning Fork (DETF) resonator for this work. The pressure sensor design is based on fabricating two resonant structures side by side using MEMS Integrated Design for Inertial Sensors (MIDIS) process, a commercial pure-play MEMS process...
We present the design and simulation of temperature compensated Radio-Frequency (RF) Free-Free (FF) beam MEMS resonators that are developed using PolyMUMPS, which is a commercial multi-user process available from MEMSCAP. The proposed devices, which operate at 10MHz and 20MHz, are designed using CoventorWare finite element modeling software. We present a novel and effective temperature compensation...
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