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3D-Stacked ICs (3D-SIC) based on Through-Silicon Vias (TSVs) offer alleviation of the performance and interconnect density bottlenecks faced by traditional CMOS scaling. As a result there is a lot of industrial focus to make this technology available for the next generation of SoCs. However, for 3D integration to become a viable product approach, it requires that the additional processing steps necessary...
Networks-on-chip have been developed in the last few years to address the scalability challenges of global on-chip communication. VLSI technology is now rapidly moving into vertical stacking to overcome fundamental communication and integration bottlenecks, however this technology is not mature yet, and significant reliability challenges must be overcome. In this paper we describe our effort in establishing...
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