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A compact module for wireless triple-mode, Wi-Fi, Bluetooth, and GPS, by using system-on-package (SoP) technology are presented in this paper. A CMOS IC for wireless communication is embedded in printed-circuit-board (PCB) and other components are mounted in PCB In order to implement a slim and compact module. A proposed module is composed of a Wi-Fi IC, a Bluetooth IC, GPS IC, a Front-End-Module...
A compact module for wireless triple-mode, Wi-Fi, Bluetooth, and GPS, by using system-on-package (SoP) technology are presented in this paper. A CMOS IC for wireless communication is embedded in printed-circuit-board (PCB) and other components are mounted in PCB In order to implement a slim and compact module. A proposed module is composed of a Wi-Fi IC, a Bluetooth IC, GPS IC, a Front-End-Module...
In this paper, a novel integrated dual-mode RF FEM for Wireless Fidelity (Wi-Fi) and Bluetooth application is realized by low temperature co-fired ceramic (LTCC) technology. The proposed dual-mode RF FEM has 4 ports and consists of a novel selectable filter, which are fully embedded in the LTCC substrate, and 3 PIN diodes at each port except antenna port for shortening to the ground or not. This selectable...
This paper presents a module for Wi-Fi by using system-on-package (SoP) technology. This module is composed of a single-pole-double-throw (SPDT) IC, a power amplifier module (PAM), a Tx low-pass-filter (LPF), a matching stage for a PAM, a Rx band-pass-filter (BPF), and decoupling capacitors to reject DC bias noise. All components are fully embedded in organic substrate in order to implement a slim...
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