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A compact module for wireless triple-mode, Wi-Fi, Bluetooth, and GPS, by using system-on-package (SoP) technology are presented in this paper. A CMOS IC for wireless communication is embedded in printed-circuit-board (PCB) and other components are mounted in PCB In order to implement a slim and compact module. A proposed module is composed of a Wi-Fi IC, a Bluetooth IC, GPS IC, a Front-End-Module...
A compact module for wireless triple-mode, Wi-Fi, Bluetooth, and GPS, by using system-on-package (SoP) technology are presented in this paper. A CMOS IC for wireless communication is embedded in printed-circuit-board (PCB) and other components are mounted in PCB In order to implement a slim and compact module. A proposed module is composed of a Wi-Fi IC, a Bluetooth IC, GPS IC, a Front-End-Module...
This paper presents a compact module for a mobile TV by using system-on-package (SoP) technology. In order to implement a slim and compact module, a mobile TV chip is embedded in printed-circuit-board (PCB) and other components are mounted in PCB. This module is composed of a mobile TV IC, a BPF, a crystal, regulators, shunt capacitors, and a loop filter. This module uses lamination process by using...
This paper presents a module for Wi-Fi by using system-on-package (SoP) technology. This module is composed of a single-pole-double-throw (SPDT) IC, a power amplifier module (PAM), a Tx low-pass-filter (LPF), a matching stage for a PAM, a Rx band-pass-filter (BPF), and decoupling capacitors to reject DC bias noise. All components are fully embedded in organic substrate in order to implement a slim...
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