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Optoelectronic packaging is a challenge for optoelectronic device and optoelectronic integration. In the packaging level, optical under fill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectronic packaging. To prepare this challenge, a wide range of analysis and expertise for integrated optoelectronics,...
This paper focuses on the research of optical vertical interconnect. To achieve optical vertical interconnect a new method for fiber plugging is introduced which also can be used for metal plugging. Because the pitch of both light spot of VCSEL array and sensitive surface of PD array is 250 um, and the pad pitch of VCSEL array and PD array are also 250um. So the pitch of V-Shape Groove or U -Shape...
In this paper, we discuss the optimization of the high frequency performance of a parallel optical transceiver module, which is electrically pluggable, and its test board. A 6-layer printed circuit board (PCB) with embedded high-dielectric constant (Dk) material was built as a substrate for the optical transceiver module. An analysis of the signal integrity (SI) and power integrity (PI) is carried...
High density, large bandwidth and lower power consumption link and switch inter-system is required. Short-distance parallel optical link has become the hotspot of research because of its advantage compared with electrical link. Board communications have received a lot of attention. Most of the recent developments target 10Gbps-class systems such as super computers or high-speed IP switches. This paper...
In this paper we present several failures in optical packaging. Then we analysis the main reasons of these failures. Next, we suggest ways to avoid similar failures. Several simple examinations are also introduced. Innovative diagnostics methods are described and time saving test methods are described.
The fabrication process of a 12-channel parallel optical transceiver module developed in our group is presented in this paper. The module is composed of a VCSEL array, a PIN PD array, a VCSEL driver chip, a TIA/LA chip and supporting PCB and connector. A SiOB and its vertical assembly are emphasized as the highlights of the structure of this module, which is promising to effectively reduce the package...
A compact 4times2-channel parallel optical MCM transceiver with data rates up to 3.125 Gb/s per channel was studied for very short reach (VSR) interconnection. The transceiver was based on 1times4 VCSEL and PD arrays of 850 nm wavelength, and a 12-fiber-ribbon as the transmission medium. Greatly relaxed alignment tolerance and high coupling efficiency between optoelectronic (OE) device arrays and...
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