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The paper presents creep data, that was gained on non eutectic SnAgCu-solder specimens with a variety of compositions. The non eutectic SnAgCu-alloys were tested in different specimen sizes: bulk specimens, FBGA solder balls, flip chip solder joints. The results of the creep experiments show that both solder alloy composition and solder joint size have a significant influence of the creep properties...
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