Search results for: Y.C. Chan
Journal of Electronic Materials > 2008 > 37 > 4 > 469-476
IEEE Transactions on Device and Materials Reliability > 2006 > 6 > 3 > 421 - 428
Journal of Alloys and Compounds > 2005 > 392 > 1-2 > 237-246
Journal of Electronic Materials > 2008 > 37 > 4 > 469-476
IEEE Transactions on Device and Materials Reliability > 2006 > 6 > 3 > 421 - 428
Journal of Alloys and Compounds > 2005 > 392 > 1-2 > 237-246