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The electric current effect on the microstructure of ball grid array (BGA) solder joint was investigated at room temperature with current density of the order of 10 2 A/cm 2 . Sandwich-like samples of ‘Au/Ni/Cu pad-Sn37Pb solder ball-Au/Cu pad’ structure were used for current stressing with different time/current density combinations. Extensive dissolution of pad metal, massive formation...
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