The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We have developed a surface micromachining process utilizing the Cu - Ni dual metal layer as the sacrificial layer to fabricate the metal-contact RF MEMS switch. No seed layer is required for electroplating the structural layer, when the metallic sacrificial layer, such as Ni and Cu, is employed. Some inherit problems were found when using a single metal sacrificial layer. Our experimental results...
A bulk micromachined tunneling accelerometer on Pyrex 7740 glass substrate is reported in this paper, which is capable of out-of-plane sensing and intended for highly sensitive inertial measurements. Low stress in single crystal Si (SCS) proof mass-suspension structure and low thermal incompatibility between SCS structural layer and substrate can minimize low frequency noise of the device. Double-face...
In this paper, the design and analysis of a bulk micromachined distributed digital microwave phase shifter is introduced. This device, with nonlinear delay line architecture, utilizes 12 butterfly-like microbridges on glass substrates as loading varactors to deliver true time delay performance. The loading capacitance switches between two values, with the pull-in and deformation of the microbridges,...
This paper reports a bulk Si micromachined distributed digital microwave phase shifter with butterfly-like loading microbridges. Having a multilayer structure, the bridges use heavily boron-doped single crystal silicon (SCS) as the skeleton layer, so that the excellent mechanical property of SCS can be utilized to ensure the performance and reliability of the device. The fabrication is shown to be...
We have developed a novel (silicon-on-insulator (SOI), microelectromechanical systems (MEMS)) SOI-MEMS technology combined with anodic bonding process. A metal layer on the glass substrate can provide out-of-plane electrodes and interconnects. More importantly, a wafer-level package of mechanical structures constructed by the top layer of the SOI wafer can be formed by the glass substrate and the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.