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One interesting and challenging BGA solder ball cracked issue occurred at certain electronic production line. This paper is expected to carry out a detail investigation and improvement plan on failure mechanism, by combining some experiment methods, such as SEM/EDX, pin pull test, cross section, dye & pry etc. And also environment test thermal cycling is involved in to qualify the improved products...
In this paper, a pin pull test is introduced as an effective way to assess the PCB pad strength. The pad strength is evaluated by different level of strain, pad type, PCB life phase and accumulation effect of various stations. Finite element analysis (FEA) is employed to analyze whether the PCB material affects the pad strength. It is found that PCB pad strength is sensitive to the rework process,...
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