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High aspect-ratio micro-channels were fabricated in fused silica using a high- repetition-rate 522-nm femtosecond laser and selective chemical etching with diluted hydrofluoric acid. Single and multi-scanning writing is compared for controlling cross-sectional profile and wall roughness.
A new domain of rapid waveguide writing using 50 to 1500 fs laser pulses is presented for fused silica. Type II photosensitivity mechanisms are inferred for the low-loss waveguides, imprinted with coarsely overlapping pulses.
Waveguides were fabricated in fused silica using kHz and MHz repetition rate femtosecond lasers. Raman and fluorescence microscopy showed increases in 3-membered rings for both cases and fewer NBOHC-defects when writing with the MHz laser.
A 64/spl times/64 element kinoform was microfabricated in fused silica by direct ablation with a pulsed 157-nm laser source that circumvents multistep lithographic patterning and etching routines. A 4-level design of /spl sim/300-nm etch layers is described.
Buried refractive index changes of 10/sup -4/ to 10/sup -3/ were written in fused silica with F/sub 2/ laser nanosecond-pulse ultraviolet radiation, forming visible- and infrared-confining cylindrical waveguides of 1.6 dB/cm loss and 7/spl times/10/sup -6/ birefringence.
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