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All-wet fabrication process using electroless deposition of barrier and Cu seed layers has been achieved for a high aspect ratio through-Si via (TSV). Formation of thin barrier metal layer of NiB and CoB is possible by the use of nano particles catalyst which is densely adsorbed on SiO2 of TSV sidewall. Silane coupling agent with 3-aminopropyl-triethoxysilane is effective for enhancement of adsorption...
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