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In this paper, the moisture effect on the warpage of plastic package is studied through experimental and numerical method. Many investigations have proved that polymer materials can expand after absorbing moisture. And coefficient of moisture expansion (CME) is proposed to quantitatively describe polymer expansion caused by moisture. The plastic package consists of epoxy molding compound (EMC) and...
In this paper, the moisture effect on the warpage of plastic package is studied through experimental and numerical method. Many investigations have proved that polymer materials can expand after absorbing moisture. And coefficient of moisture expansion (CME) is proposed to quantitatively describe polymer expansion caused by moisture. The plastic package consists of epoxy molding compound (EMC) and...
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