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A study was conducted to assess the backward compatibility of three different lead-free BGA components using Jedec Solderability testing method (JESD22-B102D). The test was conducted at component level. The three components tested were 29??29 mm Thermally Enhanced PBGA (TePBGA-II) and 35??35mm Tape BGA (TBGA) with SAC387 and Sn3.5Ag solder balls, as well as 33??33 mm Flip Chip HiCTE BGA with only...
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