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The challenges facing the development of monolithic instrumentation systems are reviewed. Sensor technology is discussed, and examples of merging transducer and circuit processes are given. It is noted that, for many future systems, transducers, analog circuits, logic, and memory should probably be merged on a single chip, and system-level standards are needed to focus such efforts. It is concluded...
A 32-*32-element capacitive silicon tactile imager has been developed for use in precision robotics applications where high density and high resolution are important. The silicon chip measures 1.8 cm*1.7 cm and is organized in an X-Y matrix of 1024 capacitor elements on 0.5-mm centers. The process uses two boron diffusions (deep and shallow) followed by a silicon-to-glass electrostatic bonding step...
The author reports a monolithic transducer array for measuring the physical variables associated with gas flow up to 8 m/s. The transducers are supported on micromachined dielectric windows and measure flow velocity, flow direction, ambient gas temperature, and ambient pressure. The gas velocity sensor is based on a full-diaphragm structure and for a 1-mm*1-mm window achieves an output voltage of...
The authors report an integrated silicon sensor capable of monitoring the purity of semiconductor process gases at or near the point of use. The device utilizes a selectively etched dielectric window, which supports a thin deposited metal film and electrodes for sensing the film conductivity. The planar 1.2-mm*1.2-mm*1- mu m-thick window has a buried diffused-silicon heater. The window has a heating...
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