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Electromigration (EM)-induced damage in lead-free solders strongly depend on the Sn grain orientation in the Pb-free solder joint. Significant damage can develop at a very early stage when the c-axis of a Sn-grain is oriented close to the current direction. Rapid dissolution of both intermetallic compounds (IMC) and under-bump metallurgy (UBM) that led to significant cavitations at interface is caused...
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