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Two commonly used Pb-free solders, SnAg and SnCu, are studied for electromigration (EM) reliability. Two major EM failure mechanisms are identified in Sn-based Pb-free solders, which is mainly due to the differences in microstructures and Sn-grain orientation. In general, the EM damage in SnCu solder is driven by the fast interstitial diffusion of Ni and Cu away from solder/UBM interface and leads...
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