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We fabricated ferroelectric (K,Na)NbO3 (KNN) capacitors on Pt(111) or Pt(100) bottom electrodes with different substrate temperature by pulsed laser deposition. The annealing effect in O2 was also investigated. KNN film on Pt(100) substrate exhibited crystal grain clearly than that on Pt(111). The 2Pr and 2Vc, measured by ferroelectric tester, of Pt/KNN/Pt(111) for 400°C and 600°C were 4.28 and 4...
La-doped lead zirconate titanate (Pb,La)(Zr,Ti)O3 (PLZT) films were prepared via chemical solution deposition. Then, Pt, Al-doped ZnO (AZO), or Sn-doped In2O3 (ITO) top electrodes were deposited on the PLZT films to investigate ferroelectric properties. Three kinds of ferroelectric capacitors were annealed in 3% D2 (with N2 as a balance gas) to compare hydrogen-induced degradation of ferroelectric...
We fabricated ferroelectric (Pb,La)(Zr,Ti)O3 (PLZT) capacitors by pulsed lase deposition (PLD) and investigated the effects of substrate temperature during PLD, Pb contents of the target, annealing temperature and period to improve ferroelectric properties. The R.T. deposition with higher Pb contents in the target (1.27) and subsequent annealing at 750°C for 10 min exhibited the best ferroelectric...
We fabricated ferroelectric (Pb,La)(Zr,Ti)O3 (PLZT) capacitors with Pt, Al:ZnO, or Sn:In2O3 top electrodes. The remnant polarization decreased for these PLZT capacitors after forming gas (3%H2/balance N2) annealing at 200°C and 1 Torr, especially for PLZT capacitor with Pt top electrodes due to the catalytic effect of Pt. The time-of-flight secondary ion mass spectrometry depth profile showed that...
TSV(Through Silicon Via) is promising interconnection for the next generation smartphone, driving assistance and medical care system because of its ability of high speed image processing and low energy consumption. Conventional TSV electrodeposition requires several 10 minutes to hour because of applying small current of less than 10 mA/cm2. We are able to electrodeposit the 6 μm diameter and depth...
As a signal detection method for multiple-input multiple-output (MIMO) communications, this paper proposes multi-stream constrained search (MSCS) that achieves very good trade-off between computational complexity and bit error rate (BER) performance. The proposed method sets a minimum mean-squared error (MMSE) detection result to the starting point. From this point, MSCS searches for signal candidates...
To enable low power consumption and the access speed increase, three dimensional packaging of semiconductor chips has been proposed. In particular, a high-aspect ratio through silicon via (TSV) allows short chip to chip interconnection. 4 μm diameter and aspect ratio of 7.5 via TSV has filled. The perfect via filling was achieved within 25 minutes with the increasing irev/|ion| ratios of periodic...
High-speed copper electrodeposition is needed to optimize the TSV process with a high throughput. To inhibit electrodeposition on the top surface of the TSV, the ODT was microcontact-printed on the top surface. The ODT microcontact-printing effectively inhibits the copper electrodepositon on the top surface. With 1.0 ppm SDDACC, V-shapes were formed in the via cross sections and these shapes lead...
This paper proposes multipath division turbo equalization with block inter-carrier interference cancellation (MD-BIC) for orthogonal frequency division multiplexing (OFDM). When the multipath delay difference exceeds the cyclic prefix (CP) length, the OFDM transmission performance suffers severely due to inter-symbol interference (ISI) and inter-carrier interference (ICI). Cellular systems with amplify-and-forward...
New diagnostic, “electron-beam-shadowgraph”, is examined for taking the spatial distribution of transient fields in a plasma. It is applied to the unmagnetized plasma, which is perturbed by an intense relativistic electron beam (IREB). Strong deflection is observed with duration of about 1 µs just after the IREB injection. The shadowgraph image is characterized by presence of aggregate holes. The...
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