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The paper reports the results of a systematic improvement project on the thermal cycle (TC) lifetime prediction of BGA memory modules with SnAg1.0Cu0.5 and SnAg1.0Cu0.5Ni0.05 solder alloys. The pre-existing lifetime modeling scheme allowed predictions with an inaccuracy factor of about 1.6plusmn1 on average while in TC experiments, the characteristic lifetime, N63, showed a standard deviation of about...
The paper reports a comprehensive study on accelerated temperature cycling tests. Based on a DoE test plan, multiple accelerated temperature cycling tests were performed on different SMT soldered 512Mb FBGA daisy chain packages. The thermo-mechanical behavior of two SnAgCu solder alloys was studied. A sensitivity analysis assessed the effects of the TC stress tests factors on the characteristic lifetime...
Recent studies revealed that there is no simple ldquodrop inrdquo solution for the lead-free replacement of SnPb joints, instead different Sn-based solders are advantageous for different use conditions, which can be dominated either by drop loading or by thermal cyclic loading in harsh use conditions. By way of high-speed shear testing reliability assessments of components during drop and shock events...
To allow realistic stress assessments of BGA modules during drop and shock events, the dynamic mechanical behavior of SAC BGA solder joints was determined by a combination of fast shear tests and FEM simulations. The goal has been the development of a validated material model for SnAg1.0Cu0.5 BGA solder joints that accounts for dynamic material hardening and the dependency of the fracture mode on...
In order to investigate the time-independent behaviour of solder joints at high strain rates, a test setup was created capable of measuring the force vs. time reaction of small solder joint in shear loading at strain rates between 10 -1 - 104 [1/s]. The paper describes the design of this high strain rate tester. Details providing for the fast and high resolution force measurement are given. The results...
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