The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Recent studies revealed that there is no simple ldquodrop inrdquo solution for the lead-free replacement of SnPb joints, instead different Sn-based solders are advantageous for different use conditions, which can be dominated either by drop loading or by thermal cyclic loading in harsh use conditions. By way of high-speed shear testing reliability assessments of components during drop and shock events...
To allow realistic stress assessments of BGA modules during drop and shock events, the dynamic mechanical behavior of SAC BGA solder joints was determined by a combination of fast shear tests and FEM simulations. The goal has been the development of a validated material model for SnAg1.0Cu0.5 BGA solder joints that accounts for dynamic material hardening and the dependency of the fracture mode on...
The knowledge of deformation and fatigue behaviour is vital for understanding reliability problems and builds the basis for mechanical simulations, which quantify strains, stresses and even product life-times. The focus of this paper is the AuSn interconnect in the form of eutectic AuSn and fine pitch flip-chip interconnects consisting in this example of an Au-phase and a zetha-phase. In the fist...
It is necessary to improve the lifetime prediction based on FE-methods of different electronic packages in order to reduce the time and costs of new developments. This paper purposes a method describing the crack propagation of chip on copper substrate solder joints. The chips that were studied are power transistors. They were soldered on copper substrate (NiAu metallization) with two different solder...
The paper presents the method of generating lifetime-prediction-laws on special prepared specimen. The combination of thin- and thick-film technology allows building up test probes very similar to electronic packages including the measurement issues. Influences of pad surface metallurgy, microstructure of solder and in eutectic solder alloys are regarded. The investigation objects provide monitoring...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.