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Solder joining is one of the interconnection methods in microelectronic packaging. The robustness of the solder ball attachment to the packages determines the solder joint strength between solders and the under-bump metallization (UBM). This paper discussed the solder joint shear strength between Sn/4.0/0.5Cu with containing 20-50 ppm phosporus and Sn/3.8Ag/0.7Cu deposited onto selective plating Ni/Au...
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