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The process of dispensing gel above the silicon chip aimed at protecting chip surface and bonding wire is one of the most critical steps in the production of highly accurate low-pressure sensor modules. Numerous research efforts focused on the influences of dispensing process parameters, configuration and mechanical behavior of cured gel on the performance of sensors, while few concerns were taken...
The process of dispensing gel above the silicon chip aimed at protecting chip surface and bonding wire is one of the most critical steps in the production of highly accurate low-pressure sensor modules. Numerous research efforts focused on the influences of dispensing process parameters, configuration and mechanical behavior of cured gel on the performance of sensors, while few concerns were taken...
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