The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With the popularity of the Internet and the development of social media, the Online Word of Mouth (OWOM) has brought up growing influences on movie box office, while the development of big data technology provides a new approach and method for the research of this issue. Based on the major OWOM reputation index of influential movie box office, having 218 movies related data obtained from Mtime, going...
The self-annealing effect of electroplated copper films was investigated by measuring the time dependence of the film stress for different film thicknesses between 1.5μm and 20μm. This recrystallization process results in significant microstructure change and a film-thickness-dependent stress evolution at room temperature. This behavior can be explained by the superposition of grain growth and grain...
A multi-temperature-cycle wafer curvature experiment was performed in order to study the temperature dependent material properties of copper films. The specimen consists of 20μm copper film electrochemically deposited on a silicon wafer. Focused Ion Beam and Electron Back-Scatter Diffraction were used to characterize the microstructure of copper films. Wafer curvature (wafer bow) measurements were...
Interfacial delamination has been a major reliability issue for both BEoL and packaging systems. The failure is often due to poor adhesion of interfaces. Thus characterization of interfacial properties is critical for material selection and process control. Conventional methods for interfacial adhesion and fracture toughness measurements are generally based on linear elastic fracture mechanics. More...
Electroplated Cu films are known to change their microstructure at room temperature due to the self-annealing effect. This recrystallization process results in a film-thickness-dependent stress evolution. Films with the thickness of 5μm and below decrease in stress with time, while thicker films reveal initially an increase in film stress followed by a stress relaxation at a later stage. This behavior...
We report intense green photoluminescence from amorphous oxidized silicon nitride film (a-SiN:O). A-SiN:O light-emitting devices of green-yellow color are successfully fabricated. Notably, EL efficiency can be significantly enhanced by modulating Si/N ratio in luminescent active layer.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.