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It is found that the morphologies and orientations of Cu6Sn5 can be well controlled through designing orientations of Cu single crystal substrates. On (001) and (111) Cu single crystals, Cu6Sn5 grains display regular prism-type morphology and align either along two perpendicular directions or along three directions having an angle of 60deg between each other. By electron backscatter diffraction (EBSD)...
The interfacial reaction between Sn-3.8Ag-0.7Cu solder and FeNi substrate was much slower, resulting in a thin FeSn2 IMC layer at the interface. Interfacial bond between FeNi and Sn-3.8Ag-0.7Cu solder ball was examined by ball shear tests and the shear test results were compared to those on Cu and deposited Ni layers. Ball shear test showed that the Sn-Ag-Cu/FeNi-Cu interface had a comparable strength...
Si-Sb-Te (SST) system materials were investigated for non-volatile phase change memory application. By contrast to the conventional GST films, the SST films exhibit stronger thermal stability and smaller RESET current, which were resulted from the self-confine and self-heat mechanisms by the amorphous Si-rich regions surrounding the phase change crystalline in SST. It shows a good promise for non-volatile...
Superconducting Fault Current Limiter (SFCL) is an attractive appliance for modern electrical power system. A 10.5kV/1.5 kA three-phase HTS fault current limiter was developed by IEE, CAS. This improved rectifier-type SFCL with HTS coil of 6.25 mH is going on a demonstrated long-term reliable operation in a real 10.5 kV substation located in Hunan, China. In a three-phase-to-ground short circuit test...
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