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This paper presents the first demonstration of a “zero-undercut” precision formation of ultrafine-line copper conductor patterns for redistribution layers (RDL) and thin film RF passives. This is accomplished by using a highly-anisotropic and uniform copper plasma-etching process to remove the seed layer with no lateral etching of the copper patterns, unlike what is seen with traditional seed-layer...
When nanoparticles are incorporated into surfaces to generate roughness, adhesion of the particles is critical to achieve a durable superhydrophobic surface. In this investigation, we explored the use of bis-phenol A based epoxy and silica nanoparticles to form a composite layer on substrates. After an plasma treatment of the surface layer, the epoxy was etched away and silica nanoparticles...
The creation of superhydrophobic surfaces that mimick lotus leaves is a relatively new research field that has attracted considerable attention. It shows promising applications in self-cleaning, microfluidics, bio-antifouling, and anticorrosion etc. Generally two requirements must be satisfied in order to achieve superhydrophobicity. First, the surface must be hydrophobic with a contact angle greater...
Carbon nanotubes (CNTs) have been proposed as electrical interconnects in microelectronic devices to address such problems as stress, electromigration, and heat removal. For electronic device and packaging applications, chemical vapor deposition (CVD) methods are particularly attractive due to characteristic CNT growth features such as selective spatial growth, large area deposition capability and...
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